K4H281638L Datasheet, PDF (23/32 Pages) Samsung semiconductor – 128Mb L-die DDR SDRAM Specification

K4H281638L
DDR SDRAM
21.0 System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR400 and DDR333 devices to ensure proper system perfor-
mance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
AC CHARACTERISTICS
PARAMETER
SYMBOL
DQ/DM/DQS input slew rate measured between
V_IH(DC), V_IL(DC) and V_IL(DC), V_IH(DC)
DCSLEW
DDR400
MIN
MAX
0.5
4.0
DDR333
MIN
MAX
0.5
4.0
Units Notes
V/ns
a, l
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Input Slew Rate
∆tIS
∆tIH
Units
0.5 V/ns
0
0
ps
0.4 V/ns
+50
0
ps
0.3 V/ns
+100
0
ps
Notes
i
i
i
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Input Slew Rate
∆tDS
∆tDH
Units
0.5 V/ns
0
0
ps
0.4 V/ns
+75
+75
ps
0.3 V/ns
+150
+150
ps
Notes
k
k
k
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Delta Slew Rate
∆tDS
∆tDH
Units
Notes
+/- 0.0 V/ns
0
0
ps
j
+/- 0.25 V/ns
+50
+50
ps
j
+/- 0.5 V/ns
+100
+100
ps
j
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Slew Rate Characteristic
Typical Range
(V/ns)
Minimum
(V/ns)
Maximum
(V/ns)
Pullup Slew Rate
1.2 ~ 2.5
1.0
4.5
Pulldown slew
1.2 ~ 2.5
1.0
4.5
Notes
a,c,d,f,g,h
b,c,d,f,g,h
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Slew Rate Characteristic
Typical Range
(V/ns)
Minimum
(V/ns)
Maximum
(V/ns)
Pullup Slew Rate
1.2 ~ 2.5
0.7
5.0
Pulldown slew
1.2 ~ 2.5
0.7
5.0
Notes
a,c,d,f,g,h
b,c,d,f,g,h
Table 7 : Output Slew Rate Matching Ratio Characteristics
AC CHARACTERISTICS
DDR400
PARAMETER
MIN
MAX
Output Slew Rate Matching Ratio (Pullup to Pulldown) 0.67
1.5
DDR333
MIN
MAX
0.67
1.5
Notes
e, l
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Rev. 1.2 Feburary 2009