PD17P709A_15 Datasheet, PDF (34/38 Pages) Renesas Technology Corp – 4-BIT SINGLE-CHIP MICROCONTROLLER WITH DEDICATED HARDWARE FOR DIGITAL TUNING SYSTEM

µPD17P709A
5. RECOMMENDED SOLDERING CONDITIONS
The µPD17P709A should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 5-1. Surface Mounting Type Soldering Conditions
µPD17P709AGC-3B9: 80-pin plastic QFP (14 × 14)
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235°C, Time: 30 seconds MAX. (at 210°C or higher.),
Count: Three times or less
Package peak temperature: 215°C, Time: 40 seconds MAX. (at 200°C or higher.),
Count: Three times or less
Solder bath temperature: 260°C MAX., Time: 10 seconds MAX., Count: Once,
Preheating temperature: 120°C MAX. (package surface temperature)
Pin temperature: 300°C MAX., Time: 3 seconds MAX. (per pin row)
Recommended
Condition
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet U15723EJ1V0DS