HYB18H1G321AF Datasheet, PDF (3/48 Pages) Qimonda AG – GDDR3 Graphics RAM 1-Gbit GDDR3 Graphics RAM

Internet Data Sheet
1
Overview
HYB18H1G321AF–10/11/14
1-Gbit GDDR3
This chapter lists all main features of the product family HYB18H1G321AF–10/11/14 and the ordering information.
1.1
Features
• 1.8 V V_DDQ IO voltage
• 1.8 V V_DD core voltage
• Monolithic 1Gbit GDDR3 with an internally programmable
organization of either two separate 512MBit memories
(2048 K x 32 I/O x 8 banks) with separate Chip Select, or
one 1Gb memory (4096 K x 32 I/O x 8 banks)
• Two CS: 4096 rows and 512 columns (128 burst start
locations) per bank
– One CS: 8192 rows and 512 columns (128 burst start
locations) per bank
• Differential clock inputs (CLK and CLK)
• CAS latencies of 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17
• Write latencies of 3, 4, 5, 6, 7
• Burst sequence with length of 4, 8
• 4n pre fetch
• Short RAS to CAS timing for Writes
• t_RAS Lockout support
• t_WR programmable for Writes with Auto-Precharge
• Data mask for write commands
• Single ended READ strobe (RDQS) per byte. RDQS edge-
aligned with READ data
• Single ended WRITE strobe (WDQS) per byte. WDQS
center-aligned with WRITE data
• DLL aligns RDQS and DQ transitions with Clock
• Programmable IO interface including on chip termination
(ODT)
• Autoprecharge option with concurrent auto precharge
support
• 8k Refresh (32ms)
• Autorefresh and Self Refresh
• PG-TFBGA-136 package
• Calibrated output drive. Active termination support
• RoHS Compliant Product ¹⁾
Part Number¹⁾
HYB18H1G321AF–10/11/14
Organization
×32
1) HYB: designator for memory components
18H: VDDQ = 1.8V
1G: 1 Gbit
32: x32 organization
A: Product Revision
F: Lead and Halogen-Free
Clock (MHz)
1000 @CL12
700 @CL11
900 @CL11
TABLE 1
Ordering Information
Package
PG-TFBGA-136
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 0.92, 2007-10
3
06122007-MW7D-3G3M