TDA8007B Datasheet, PDF (27/36 Pages) NXP Semiconductors – Double multiprotocol IC card interface

Philips Semiconductors
Double multiprotocol IC card interface
Product specification
TDA8007B
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Auxiliary cards contacts (pins C41, C81, C42 and C82) (pins C41 and C81 have an integrated 10 kΩ pull-up
at V_CC1, pins C42 and C82 have an integrated 10 kΩ pull-up at V_CC2)
V_o(inactive)
I_inactive
output voltage inactive
current from pins C4 or C8
when inactive and pin
grounded
no load
I_inactive = 1 mA
0
−
0.1
V
−
−
0.3
V
−
−
−1
mA
V_OL
LOW-level output voltage C4 or C8 configured as an output; 0
I_OL = 1 mA
−
0.3
V
V_OH
HIGH-level output voltage I/O configured as an output;
0.8V_CC
−
V_CC + 0.25 V
I_OH < −40 µA
V_IL
LOW-level input voltage
C4 or C8 configured as an input −0.3
−
+0.8
V
V_IH
HIGH-level output voltage C4 or C8 configured as an input 1.5
−
V_CC
V
I_IL
LOW-level input current on V_IL = 0
pins C4 or C8
−
−
600
µA
I_LI(H)
input leakage current HIGH V_IH = V_CC
on pins C4 or C8
−
−
20
µA
t_i(tr), t_i(tf)
t_o(tr), t_o(tf)
t_W(pu)
R_int(pu)
f_(max)
input transition times
output transition times
width of active pull-up pulse
internal pull-up resistance
between C4/C8 and V_CC
maximum frequency on
C4 or C8
C_L = 30 pF
C_L = 30 pF
−
−
1
µs
−
−
0.1
µs
−
200 −
ns
8
10 12
kΩ
−
−
1
MHz
Timing
t_act
activation sequence duration
t_de
deactivation sequence
duration
−
−
130
µs
−
−
150
µs
Protections and limitations
I_CC(sd)
I_I/O(lim)
I_CLK(lim)
I_RST(sd)
shutdown and limitation
current at V_CC
limitation current on the I/O
limitation current on pin CLK
shutdown and limitation
current on RST
T_sd
shutdown temperature
Card presence inputs 1s (pins PRES1 and PRES2)
−
−100 −
mA
−15
−
+15
mA
−70
−
+70
mA
−20
−
+20
mA
−
150 −
°C
V_IL
V_IH
I_IL(L)
I_IL(H)
LOW-level input voltage
HIGH-level input voltage
input leakage current LOW
input leakage current HIGH
V_IN = 0
V_IN = V_DD
−
−
0.3V_DD
V
0.7V_DD
−
−
V
−20
−
+20
µA
−20
−
+20
µA
2000 Nov 09
27