TDA8007B Datasheet, PDF (23/36 Pages) NXP Semiconductors – Double multiprotocol IC card interface

Philips Semiconductors
Double multiprotocol IC card interface
Product specification
TDA8007B
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
V_DDA
V_DD
V_n
analog supply voltage
supply voltage
input voltage on all pins except S1, S2, S3, S4
and V_UP
input voltage on pins S1, S2, S3, S4 and VUP
I_n1
DC current into all pins except S1, S2, S3, S4
and V_UP
I_n3
DC current from or to pins S1, S2, S3, S4
and V_UP
P_tot
total power dissipation
T_amb = −20 to +85 °C
T_stg
IC storage temperature
T_j
junction temperature
V_es
electrostatic discharge voltage
on pins I/O1, V_CC1, RST1, CLK1, GNDC1,
PRES1, I/O2, V_CC2, RST2, CLK2, GNDC2
and PRES2
on pins C41, C42, C81 and C82
on pins D0 to D7
on other pins
MIN.
−0.5
−0.5
−0.5
MAX.
+6.5
+6.5
V_DD + 0.5
UNIT
V
V
V
−0.5
+7.5
V
−5
+5
mA
−200 +200
mA
−
700
mW
−55
+150
°C
−
125
°C
−6
+6
kV
−5.5
+5.5
kV
−1.8
+1.8
kV
−2
+2
kV
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
R_th(j-a)
from junction to ambient
CONDITIONS
in free air
VALUE
78
UNIT
K/W
2000 Nov 09
23