TDA4855 Datasheet, PDF (12/44 Pages) NXP Semiconductors – Autosync Deflection Controller ASDC

Philips Semiconductors
Autosync Deflection Controller (ASDC)
Preliminary specification
TDA4855
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL
PARAMETER
V_CC
supply voltage
V_I(n)
input voltages
BIN
HSYNC, VPOS, VAMP, VSCOR, VREF, HREF and HPOS
XRAY
V_O(n)
output voltages
VOUT1 and VOUT2
BDRV and HDRV
V_I/O(n)
input/output voltages
BOP and BSENS
FOCUS and VSYNC
I_HDRV
I_HFLB
I_CLBL
I_BOP
I_BDRV
I_EWDRV
T_amb
T_j
T_stg
V_esd
horizontal driver output current
horizontal flyback input current
video clamping pulse/vertical blanking output current
B+ control OTA output current
B+ control driver output current
EW driver output current
operating ambient temperature
junction temperature
storage temperature
electrostatic discharge for all pins (note 1)
machine model
human body model
MIN.
−0.5
MAX.
+16
UNIT
V
−0.5
+6.0
V
−0.5
+6.5
V
−0.5
+8.0
V
−0.5
+6.5
V
−0.5
+16
V
−0.5
+6.0
V
−0.5
+6.5
V
−
100
mA
−10
+10
mA
−
−10
mA
−
1
mA
−
50
mA
−
−5
mA
0
70
°C
−
150
°C
−55
+150
°C
−400
+400
V
−3 000
+3 000
V
Note
1. Machine model: 200 pF, 25 Ω, 2.5 µH; human body model: 100 pF, 1500 Ω, 7.5 µH.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
R_{th j-a}
thermal resistance from junction to ambient in free air
VALUE
55
UNIT
K/W
QUALITY SPECIFICATION
In accordance with “URF-4-2-59/601”; EMC emission/immunity test in accordance with “DIS 1000 4.6” (IEC 801.6)
SYMBOL
PARAMETER
V_EMC
emission test
immunity test
CONDITIONS
note 1
note 1
MIN.
−
−
TYP.
1.5
2.0
MAX.
−
−
UNIT
mV
V
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
1996 Jul 18
12