TCC-106 Datasheet, PDF (3/24 Pages) ON Semiconductor – Six-Output PTIC Control IC

TCC−106
RDL Pin Out
Table 1. PAD DESCRIPTIONS
Bump
Name
Type
Description
Max Voltage
(Note 1)
1
L_BOOST
AOH
Boost Inductor
25
2
AVDD
P
Analog Supply
5.5
3
GNDA
P
Analog Ground
0
4
TRIG
DIO
Trigger Signal Input (Note 2)
VIO
5
CLK
DI
MIPI RFFE / SPI Clock
VIO
6
CS
DI
Chip Select for SPI
VIO
7
DATA
DIO
Digital IO (SPI and MIPI RFFE)
VIO
8
VIO
P
Digital IO Supply
3
9
IDB0
DI
MIPI RFFE ID Bit 0 (Note 3)
VIO
10
GNDIO
P
Digital IO Ground
VIO
11
OUTA
AOH
High Voltage Output A
VHV
12
OUTB
AOH
High Voltage Output B
VHV
13
OUTC
AOH
High Voltage Output C
VHV
14
OUTD
AOH
High Voltage Output D
VHV
15
OUTE
AOH
High Voltage Output E
VHV
16
OUTF
AOH
High Voltage Output F
VHV
17
ATEST
AO
Analog Test Out (Note 4)
VREG
18
VREG
AO
Regulator Output
3.6
19
GND_BOOST
P
Ground for Booster
0
20
VHV
AOH / AIH
Boost High Voltage can be Forced Externally
25
1. For information only.
2. To be grounded when not in use.
3. This pin has to be connected to either GNDIO or VIO level, even if only SPI protocol is used. Never let it float.
4. To be grounded in normal operation.
Electrical Performance Specifications
RDL
B4
B3
C3
C4
D4
D3
E4
E3
C2
D2
E2
E1
D1
C1
B1
A1
B2
A2
A3
A4
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Rating
Unit
AVDD
Analog Supply Voltage
−0.3 to +6.0
V
VIO
IO Reference Supply Voltage
−0.3 to +3.6
V
V_I/O
Input Voltage Logic Lines (DATA, CLK, CS)
−0.3 to VIO+0.3
V
V_HVH
VHV Maximum Voltage
−0.3 to 30
V
V_{ESD (HBM)}
Human Body Model, JESD22−A114, All I/O
2,000
V
V_{ESD (MM)}
Machine Model, JESD22−A115
200
V
T_STG
Storage Temperature
−55 to +150
°C
T_{AMB_OP_MAX} Max Operating Ambient Temperature without Damage
+110
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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