TCC-106 Datasheet, PDF (22/24 Pages) ON Semiconductor – Six-Output PTIC Control IC

TCC−106
Mechanical Description: Ball Array Package
TC6 = Product Code
x
= MIPI ID
(see MIPI Version Table)
7
= Assembly Location
L
= Wafer Lot Code
Y
= Year Code
W
= Week Code
•
= Pin 1 Marker
Pb-Free (96.8% Sn/2.6% Ag/0.6% Cu)
MIPI RFFE ID Bit 1
a=0
b=1
2600 mm
±10 mm
2250 mm ±10 mm
TC6x
7LYW
250 mm dia
A1 A2 A3 A4
B1 B2 B3 B4
C1 C2 C3 C4
D1 D2 D3 D4
E1 E2 E3 E4
500 mm
400 mm
400 mm
400 mm
400 mm
500 mm
380 mm ±25 mm
200 mm ±20 mm
580 mm
Figure 17. Ball Array Package − Top View
NOTE: Die dimensions include an assumed 60 mm wide sawing kerf, this kerf width is subject to change without notice.
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