AMIS-30522 Datasheet, PDF (3/29 Pages) AMI SEMICONDUCTOR – Micro-stepping Motor Driver

AMIS-30522
GND 1
DI ²
CLK ³
NXT 4
DIR ⁵
ERR ⁶
SLA ⁷
8
32 31 30 29 28 27 26 25
AMIS-30522
24 _GND
23 _GND
22 _MOTXN
21 _MOTXN
20 _MOTYN
19 _MOTYN
18 _GND
17 GND
9 10 11 12 13 14 15 16
PC20070309.2
Figure 2: Pin Out AMIS-30522
5.1 Package Thermal Characteristics
The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the
package partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to
conduct heat away from the package. A thermal grounded pad with thermal via’s can achieve this. With a layout as shown in Figure
3, the thermal resistance junction – to – ambient can be brought down to a level of 30°C/W.
Figure 3: PCB Ground Plane Layout Condition
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