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DS50PCI401 Datasheet, PDF (14/32 Pages) National Semiconductor (TI) – 2.5 Gbps / 5.0 Gbps 4 Lane PCI Express Transceiver with Equalization and De-Emphasis
Electrical Characteristics — Serial Management Bus Interface
Over recommended operating supply and temperature ranges unless other specified.
Symbol
Parameter
Conditions
Min
Typ
SERIAL BUS INTERFACE DC SPECIFICATIONS
VIL
Data, Clock Input Low Voltage
VIH
Data, Clock Input High Voltage
2.1
IPULLUP
Current Through Pull-Up Resistor High Power Specification
4
or Current Source
VDD
ILEAK-Bus
ILEAK-Pin
CI
RTERM
Nominal Bus Voltage
Input Leakage Per Bus Segment (Note 16)
Input Leakage Per Device Pin
Capacitance for SDA and SDC (Notes 16, 17)
External Termination Resistance Pullup VDD = 3.3V,
pull to VDD = 2.5V ± 5% OR 3.3V ± (Notes 16, 17, 18)
10%
Pullup VDD = 2.5V,
(Notes 16, 17, 18)
2.375
-200
-15
2000
1000
SERIAL BUS INTERFACE TIMING SPECIFICATIONS. See Figure 7
FSMB
Bus Operating Frequency
(Note 19)
10
TBUF
Bus Free Time Between Stop and
Start Condition
4.7
THD:STA
Hold time after (Repeated) Start At IPULLUP, Max
Condition. After this period, the first
4.0
clock is generated.
TSU:STA
Repeated Start Condition Setup
Time
4.7
TSU:STO Stop Condition Setup Time
4.0
THD:DAT Data Hold Time
300
TSU:DAT
Data Setup Time
250
TTIMEOUT
Detect Clock Low Timeout
(Note 19)
25
TLOW
Clock Low Period
4.7
THIGH
Clock High Period
(Note 19)
4.0
TLOW:SEXT Cumulative Clock Low Extend
Time (Slave Device)
(Note 19)
tF
Clock/Data Fall Time
(Note 19)
tR
Clock/Data Rise Time
(Note 19)
tPOR
Time in which a device must be (Note 19)
operational after power-on reset
Max
0.8
3.6
3.6
+200
10
100
35
50
2
300
1000
500
Units
V
V
mA
V
µA
µA
pF
Ω
Ω
kHz
µs
µs
µs
µs
ns
ns
ms
µs
µs
ms
ns
ns
ms
Note 16: Recommended value. Parameter not tested in production.
Note 17: Recommended maximum capacitance load per bus segment is 400pF.
Note 18: Maximum termination voltage should be identical to the device supply voltage.
Note 19: Compliant to SMBus 2.0 physical layer specification. See System Management Bus (SMBus) Specification Version 2.0, section 3.1.1 SMBus common
AC specifications for details.
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