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MT41J64M16JT-125G Datasheet, PDF (51/214 Pages) Micron Technology – DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks
1Gb: x4, x8, x16 DDR3 SDRAM
Electrical Specifications – DC and AC
Table 27: Differential Input Operating Conditions (CK, CK# and DQS, DQS#)
Parameter/Condition
Symbol
Min
Max
Unit Notes
Differential input voltage logic high - slew
Differential input voltage logic low - slew
Differential input voltage logic high
Differential input voltage logic low
Differential input crossing voltage relative
to VDD/2 for DQS, DQS#; CK, CK#
Differential input crossing voltage relative
to VDD/2 for CK, CK#
Single-ended high level for strobes
Single-ended high level for CK, CK#
Single-ended low level for strobes
Single-ended low level for CK, CK#
VIH,diff
VIL,diff
VIH,diff(AC)
VIL,diff(AC)
VIX
VIX (175)
VSEH
VSEL
200
n/a
2 × (VIH(AC) - VREF)
VSS/VSSQ
VREF(DC) - 150
VREF(DC) - 175
VDDQ/2 + 175
VDD/2 + 175
VSSQ
VSS
n/a
–200
VDD/VDDQ
2 × (VIL(AC)-VREF)
VREF(DC) + 150
VREF(DC) + 175
VDDQ
VDD
VDDQ/2 - 175
VDD/2 - 175
mV
4
mV
4
mV
5
mV
6
mV 4, 7
mV 4, 7, 8
mV
5
mV
5
mV
6
mV
6
Notes:
1. Clock is referenced to VDD and VSS. Data strobe is referenced to VDDQ and VSSQ.
2. Reference is VREFCA(DC) for clock and VREFDQ(DC) for strobe.
3. Differential input slew rate = 2 V/ns
4. Defines slew rate reference points, relative to input crossing voltages.
5. Minimum DC limit is relative to single-ended signals; overshoot specifications are appli-
cable.
6. Maximum DC limit is relative to single-ended signals; undershoot specifications are ap-
plicable.
7. The typical value of VIX(AC) is expected to be about 0.5 × VDD of the transmitting device,
and VIX(AC) is expected to track variations in VDD. VIX(AC) indicates the voltage at which
differential input signals must cross.
8. The VIX extended range (±175mV) is allowed only for the clock; this VIX extended range
is only allowed when the following conditions are met: The single-ended input signals
are monotonic, have the single-ended swing VSEL, VSEH of at least VDD/2 ±250mV, and
the differential slew rate of CK, CK# is greater than 3 V/ns.
9. VIX must provide 25mV (single-ended) of the voltages separation.
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
51
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