MT9VDDT3272AG Datasheet, PDF (1/27 Pages) Micron Technology – DDR SDRAM UNBUFFERED DIMM

128MB, 256MB, 512MB (x72, ECC, SR), PC3200
184-Pin DDR SDRAM UDIMM
DDR SDRAM
UNBUFFERED DIMM
MT9VDDT1672A – 128MB
MT9VDDT3272A – 256MB
MT9VDDT6472A – 512MB
For the latest data sheet, please refer to the Micron^ Web
site: www.micron.com/products/modules
Features
• JEDEC-standard 184-pin dual in-line memory
module (DIMM)
• Fast data transfer rate: PC3200
• CAS Latency 3
• Utilizes 400 MT/s DDR SDRAM components
• Supports ECC error detection and correction
• 128MB (16 Meg x 72), 256MB (32 Meg x 72), 512MB
(64 Meg x 72)
• VDD= VDDQ= +2.6V
• VDDSPD = +2.3V to +3.6V
• +2.6V I/O (SSTL_2 compatible)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
• Bidirectional data strobe (DQS) transmitted/
received with data—i.e., source-synchronous data
capture
• Differential clock inputs (CK and CK#)
• Four internal device banks for concurrent operation
• Programmable burst lengths: 2, 4, or 8
• Auto precharge option
• Auto Refresh and Self Refresh Modes
• 15.6µs (128MB), 7.8125µs (256MB, 512MB)
maximum average periodic refresh interval
• Serial Presence-Detect (SPD) with EEPROM
• Programmable READ CAS latency
• Gold edge contacts
Figure 1: 184-Pin DIMM (MO-206)
Standard 1.25in. (31.75mm)
OPTIONS
• Package
184-pin DIMM (standard)
184-pin DIMM (lead-free)
• Frequency/CAS Latency
5ns, 400 MT/s (200 MHz), CL = 3
• PCB
1.25in. (31.75mm)
MARKING
G
Y
-40B
None
Table 1: Address Table
Refresh Count
Row Addressing
Device Bank Addressing
Device Configuration
Column Addressing
Module Rank Addressing
128MB
4K
4K (A0–A11)
4 (BA0, BA1)
128Mb (16 Meg x 8)
1K (A0–A9)
1 (S0#)
256MB
8K
8K (A0–A12)
4 (BA0, BA1)
256Mb (32 Meg x 8)
1K (A0–A9)
1 (S0#)
512MB
8K
8K (A0–A12)
4 (BA0, BA1)
512Mb (64 Meg x 8)
2K (A0–A9, A11)
1 (S0#)
pdf: 09005aef80a43e7d, source: 09005aef80a43d77
DDA9C16_32_64x72AG.fm - Rev. B 9/04 EN
1
©2004 Micron Technology, Inc.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.