PIC16F636T-I Datasheet, PDF (218/234 Pages) Microchip Technology – 8/14-Pin, Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC12F635/PIC16F636/639
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
NOTE 1
12
TOP VIEW
b
K
e
L
N
E
E2
EXPOSED PAD
21
D2
BOTTOM VIEW
NOTE 1
A
A3
A1
NOTE 2
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
0.80
0.85
1.00
Standoff
A1
0.00
0.01
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
5.00 BSC
Overall Width
E
6.00 BSC
Exposed Pad Length
D2
3.90
4.00
4.10
Exposed Pad Width
E2
2.20
2.30
2.40
Contact Width
b
0.35
0.40
0.48
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
–
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-122B
DS41232D-page 216
© 2007 Microchip Technology Inc.