PIC16F636T-I Datasheet, PDF (179/234 Pages) Microchip Technology – 8/14-Pin, Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC12F635/PIC16F636/639
15.8 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Para
m
No.
Sym
Characteristic
Typ Units
Conditions
TH01 θJA
Thermal Resistance
Junction to Ambient
84.6
163.0
PIC12F635
52.4
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
52.4 °C/W 8-pin DFN-S 6x5 mm package
69.8 °C/W 14-pin PDIP package
85.0 °C/W 14-pin SOIC package
PIC16F636
100.4 °C/W 14-pin TSSOP package
46.3 °C/W 16-pin QFN 4x0.9mm package
TH02 θJC
Thermal Resistance
Junction to Case
PIC16F639 108.1
41.2
38.8
PIC12F635
3.0
°C/W 20-pin SSOP package
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
3.0 °C/W 8-pin DFN-S 6x5 mm package
32.5 °C/W 14-pin PDIP package
31.0 °C/W 14-pin SOIC package
PIC16F636
31.7 °C/W 14-pin TSSOP package
2.6 °C/W 16-pin QFN 4x0.9mm package
PIC16F639 32.2 °C/W 20-pin SSOP package
TH03 TJ
TH04 PD
Junction Temperature
Power Dissipation
150 °C For derated power calculations
—
W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation
TH06 PI/O
TH07 PDER
I/O Power Dissipation
Derated Power
—
W PINTERNAL = IDD x VDD
(NOTE 1)
—
W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
—
W PDER = (TJ - TA)/θJA
(NOTE 2, 3)
Note 1:
2:
3:
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature.
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
© 2007 Microchip Technology Inc.
DS41232D-page 177