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| MAX14001 Datasheet, PDF (2/34 Pages) Maxim Integrated Products – Configurable, Isolated 10-bit ADCs for Multi-Range Binary Inputs | |||
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MAX14001/MAX14002
Configurable, Isolated 10-bit ADCs for
Multi-Range Binary Inputs
Absolute Maximum Ratings
VDDL to GNDL..........................................................-0.3V to +6V
VDD to GNDL...........................................................-0.3V to +6V
Logic-Side Inputs (CS, SCLK, SDI, FAULT) to GNDL
................................................................................. -0.3V to +6V
Logic-Side Outputs (SDO, COUT)
VDDF to GNDF.........................................................-0.3V to +6V
Short-Circuit Duration
(FAULT, COUT, SDO to GNDL or VDD).................Continuous
Continuous Power Dissipation (TA = +70°C)
20-pin SSOP...............................................................952.4mW
to GNDL............................................... -0.3V to (VDDL + 0.3V)
VREFIN, VAIN to AGND............................................-0.3V to +2V
AGND to GNDF.....................................................-0.3V to +0.3V
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
GATE to GNDF.........................................................-0.3V to +4V
Lead Temperature (soldering, 10s).................................. +300°C
IFET to GNDF........................................................-0.3V to +12V
Soldering Temperature (reflow)........................................+260°C
ISET to GNDF..........................................................-0.3V to +2V
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
20-pin SSOP
Junction-to-Ambient Thermal Resistance (θJA)...........84°C/W
Junction-to-Case Thermal Resistance (θJC)................32°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDDL - VGNDL = 1.71V to 5.5V, VDD - VGNDL = 3.0V to 3.6V, RISET = 120kâ¦, TA = -40°C to +125°C, VGNDF = VGNDL. Typical values
are at TA = +25°C with VDDL = VDD = +3.3V, RISET = 120kâ¦, VGNDF = VGNDL.) (Notes 2, 3)
PARAMETER
POWER SUPPLIES
Logic Power Supply
Logic Supply Current
Isolated DC-DC Power
Supply Input Voltage
Isolated DC-DC Supply
Input Current
Logic Power-Up Delay
Field Power-Up Delay
Field Power Supply
Gate Charge Pump
Voltage
Logic-Side Undervoltage
Lockout Threshold
Logic-Side Undervoltage
Lockout Threshold
Hysteresis
Field-Side Undervoltage
Lockout Threshold
SYMBOL
CONDITIONS
VDDL
IDDL
VDD
IDD
VDDL = 3.3V, no load, CS = high
VDD = 3.3V
VDDF
CVDDF = 0.1µF
CVDDF = 0.1µF, unregulated output voltage
VGATE 1µA pull-down
VUVLOL
VUVLOD
VUVLHYST
VDD ⥠3V
VDDL ⥠1.71V
VUVDHYST
VUVLOF (Note 4)
MIN
TYP MAX UNITS
1.71
5.5
V
0.7
1.5
mA
3.0
3.3
3.6
V
4.8
8
mA
0.2
ms
1
ms
2.5
3.0
3.5
V
3
3.6
4
V
1.5
1.6
1.66
V
2.69 2.82 2.95
V
50
mV
100
mV
1.95
2.1
2.25
V
www.maximintegrated.com
Maxim Integrated ââ 2
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