1-102974-0 Datasheet, PDF (26/321 Pages) Tyco Electronics – AMPMODU Interconnection System

3
AMPMODU Interconnection System
Thru-Hole Headers––Shrouded, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
Product Facts
I High density; contacts
spaced on .050 x .100
[1.27 x 2.54] centers
I Single row; select sizes 4
thru 50 positions
I Double row; select sizes 10
thru 100 positions
I Stand-offs for ease of
cleaning
I High temperature tolerant
thermoplastic housings
I Shrouded and unshrouded
headers available in single
and double row, vertical
and right-angle
configurations
The AMPMODU System 50
interconnection system is
designed to better meet
industry’s need for a high
density interconnect
system. The Board
Mounted Thru-Hole
Headers are available in
shrouded and unshrouded
versions. They are
composed of single and
double row post headers
with .050 x .100
[1.27 x 2.54] spacing
between contacts for
extreme density and
efficient use of printed
circuit board area. The
headers are available in
4 through 50 positions, in
a single row configuration,
and 10 through 100
positions, in a double row
design.
Board mounted post
headers are available in
right-angle and vertical
configurations. Shrouded
post headers provide
polarization and alignment
features for mating printed
circuit boards and cable
connectors, while
unshrouded headers allow
close stacking of daughter
cards. Housings for the
headers are made of black
thermoplastic material with
a 94V-0 rating. The
housings have stand-offs
for free drainage of flux
cleaning solutions.
26
1307819
CIS WR 08/2011
te.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-475-6222
Mexico: 52-55-1106-0800
L. & S. America: 54-11-4733-2200
Germany: 49-6251-133-1999
China: 86-400-820-6015
Japan: 81-44-844-8013
UK: 44-800-267-666