1-102974-0 Datasheet, PDF (151/321 Pages) Tyco Electronics – AMPMODU Interconnection System

AMPMODU Interconnection System
ACTION PIN Press-Fit Posts (Continued)
ACTION PIN posts provide a more reliable press-fit
connection. Localized pressure in the interface area provides
oxide break-through and prevents corrosion better in many
of the harshest environments to help provide a reliable
connection. Also, radial and axial distortion are controlled to
meet today’s standards for multilayer board applications.
PC Board Thickness
ACTION PIN posts are
designed for use in a variety
of PC board thicknesses.
However, certain ACTION
PIN posts are to be used in
specific ranges of board
thicknesses. To promote
optimum
performance, the
recommended board
thicknesses provided with
the connector being used
must be followed.
Œ
Ž



ΠAnnular Ring (See Note)
 Drilled Hole
Ž Copper Thickness
 Tin-lead Thickness
 Plated-Through Hole
5
ACTION PIN Post/PC Board Applications
ACTION PIN Contact
Material Thickness
Drilled Hole
Diameter^
Plating Thicknesses
Copper^Ž*
Tin-lead^
.025 [0.64]
.0453^±.001 [1.151^±0.03] .001-.003 [0.03-0.08] .0003 [0.008]Min.
*Maximum hardness of copper layer is 150 Knoop.
**Radial hole distortion.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Plated-Through
Hole Diameter^
.037-.043 [0.94-1.09]
Distortion Specification*
Average
Maximum
.0015 [0.038]
.002 [0.05]
1307819
CIS WR 08/2011
te.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-475-6222
Mexico: 52-55-1106-0800
L. & S. America: 54-11-4733-2200
151
Germany: 49-6251-133-1999
China: 86-400-820-6015
Japan: 81-44-844-8013
UK: 44-800-267-666