1-102974-0 Datasheet, PDF(14/321 Page) Tyco Electronics – AMPMODU Interconnection System

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1-102974-0 Datasheet, PDF (14/321 Pages) Tyco Electronics – AMPMODU Interconnection System

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AMPMODU Interconnection System

Board-to-Board Vertical Receptacles and Headers

2

Product Facts

I Surface-mount products for

parallel board-to-board

applications, as well as

right-angle board-to-board

and cable-to-board

applications

I High density .050 x .050

[1.27x1.27] centerline grid

I Three board-to-board stack

heights: .250 [6.35], .320

[8.13] and .390 [9.91]

I Non-protrusive metallic

holddowns

I Reliable dual beam

receptacle contacts for

redundant contact

I Duplex plated receptacle

and post contacts; gold

plated on mating areas,

tin plated on tails

I Compatible with standard

surface-mount processing

(VPR and IR)

I Receptacle and header allow

for drainage of processing

fluids

I Tape and reel packaging

available. Contact TE

for details

I Polarized header and recep-

tacle assemblies

I Sizes of 10, 20, 30, 40, 50,

60, 70, 80 and 100 positions

I Recognized under the

Component Program of

Underwriters

Laboratories Inc.,

File No. E28476 R

I Certified by

Canadian Standards

Association

R

File No. LR7189

AMPMODU 50/50 Grid

Vertical Headers and

Receptacles are designed

for parallel board-to-board

stacking in high density

applications.

Right-angle board-to-board

and cable-to-board

applications are also

possible, since the vertical

receptacles also mate with

non-latching right-angle

headers (page 19) and the

vertical headers also mate

with non-latching cable

connectors.

Available are double row,

vertical shrouded headers

and receptacles in sizes

ranging from 10 through

100 positions (in 10 position

increments).

Parallel board-to-board

stack heights of .250 [6.35],

.320 [8.13] and .390 [9.91]

are achievable by selection

of the appropriate header.

The receptacle is the same

for all three stack height

headers.

Non-protrusive metallic

holddowns are designed for

use in .062 [1.57] or thicker

PC boards and allow

surface mounting to both

sides of the board. In

addition to providing

retention during processing,

the holddowns are soldered

during reflow and therefore

provide long-term strain relief

for the solder joints.

AMPMODU 50/50 Grid

Vertical Headers and

Receptacles are designed

to be compatible with

standard surface-mount

processes; IR (infrared) and

VPR (vapor phase reflow).

The surface-mount

connectors have been

designed so that

dimensioning, tolerances,

referenced datums,

holddown characteristics

and packaging methods

result in a system that is

compatible with robotic

assembly.

The headers and

receptacles feature

polarization to prevent

misalignment.

Three Board Stack Heights

.250Â±.006

[6.35Â±0.15]

.320Â±.006

[8.13Â±0.15]

Non-Protrusive

Metallic Holddowns

.390Â±.006

[9.91Â±0.15]

14

1307819

CIS WR 08/2011

te.com

Dimensions are in inches and

millimeters unless otherwise

specified. Values in brackets

are metric equivalents.

Dimensions are shown for

reference purposes only.

Specifications subject

to change.

USA: 1-800-522-6752

Canada: 1-905-475-6222

Mexico: 52-55-1106-0800

L. & S. America: 54-11-4733-2200

Germany: 49-6251-133-1999

China: 86-400-820-6015

Japan: 81-44-844-8013

UK: 44-800-267-666

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