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ISL12022M_10 Datasheet, PDF (5/31 Pages) Intersil Corporation – Low Power RTC with Battery Backed SRAM,Integrated ±5ppm Temperature Compensation and Auto Daylight Saving
ISL12022M
Absolute Maximum Ratings
Voltage on VDD, VBAT and IRQ/FOUT pins
(Respect to Ground) . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on SCL and SDA pins
(Respect to Ground) . . . . . . . . . . . -0.3V to VDD + 0.3V
ESD Rating
Human Body Model
(Per MIL-STD-883 Method 3014) . . . . . . . . . . . >3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . .>300V
Charged Device Model . . . . . . . . . . . . . . . . . . . >2200V
Latch-up . . . . . . . . . . . . . . . . . . . . . . . . Class II Level A,
passed at +85°C ambient with the Level A latch-up
criteria of 100mA or 1.5*VMAX input
Thermal Information
Thermal Resistance (Typical) θJA (°C/W)
20 Lead SOIC (Notes 4, 5)
70
θJC (°C/W)
35
Storage Temperature . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile (Note 6) . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
5. For θJC, the “case temp” location is on top of the package and measured in the center of the package between pins 6 and 15.
6. The ISL12022M Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on
the reflow temperature and length of exposure. A general rule is to use only one reflow cycle and keep the temperature and
time as short as possible. Changes on the order of ±1ppm to ±3ppm can be expected with typical reflow profiles.
DC Operating Characteristics RTC Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise
stated. Boldface limits apply over the operating temperature range,
-40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
(Note 7) (Note 8) (Note 7) UNITS NOTES
VDD
VBAT
IDD1
IDD2
IDD3
IBAT
Main Power Supply
Battery Supply Voltage
Supply Current. (I2C Not Active,
Temperature Conversion Not
Active, FOUT Not Active)
Supply Current. (I2C Active,
Temperature Conversion Not
Active, Fout Not Active)
Supply Current. (I2C Not Active,
Temperature Conversion Active,
FOUT Not Active)
Battery Supply Current
IBATLKG Battery Input Leakage
ILI Input Leakage Current on SCL
ILO I/O Leakage Current on SDA
VBATM Battery Level Monitor Threshold
VPBM Brownout Level Monitor Threshold
VTRIP VBAT Mode Threshold
VTRIPHYS VTRIP Hysteresis
VBATHYS VBAT Hysteresis
ΔFoutT Oscillator Stability vs Temperature
ΔFoutV Oscillator Stability vs Voltage
ΔFoutI Oscillator Initial Accuracy
Temp Temperature Sensor Accuracy
(Note 15)
(Note 15)
VDD = 5V
VDD = 3V
VDD = 5V
VDD = 5V
VDD = 0V, VBAT = 3V,
TA = +25°C
VDD = 0V, VBAT = 3V
VDD = 5.5V, VBAT = 1.8V
VIL = 0V, VIH = VDD
VIL = 0V, VIH = VDD
(Note 15)
VDD = 3.3V
2.7V ≤ VDD ≤ 5.5V
VDD = 3.3V
VDD = VBAT = 3.3V
2.7
1.8
-1.0
-1.0
-100
-100
2.0
-5
-3
-3
5.5
V
5.5
V
9
4.1
7
µA 10, 11
3.5
6
µA 10, 11
200
500
µA 10, 11
120
400
µA 10, 11
1.0
1.6
µA
10
1.0
5.0
µA
10
100
nA
±0.1
1.0
µA
±0.1
1.0
µA
+100
mV
+100
mV
2.2
2.4
V
30
mV
13
50
mV
13
+5
ppm
6
+3
ppm
+3
ppm
6
±2
°C
13
5
FN6668.7
June 4, 2010