ISL12022M_10 Datasheet, PDF (31/31 Pages) Intersil Corporation – Low Power RTC with Battery Backed SRAM,Integrated ±5ppm Temperature Compensation and Auto Daylight Saving

ISL12022M
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
H
E
-B-
0.25(0.010M) B M
123
-A-
D
SEATING PLANE
A
L
h x 45°
-C-
α
e
A1
C
B
0.10(0.004)
0.25(0.010M) C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in
Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion and gate burrs shall
not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or
protrusions. Interlead flash and protrusions shall not
exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present,
a visual index feature must be located within the
crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or
greater above the seating plane, shall not exceed a
maximum value of 0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
M20.3 (JEDEC MS-013-AC ISSUE C)
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.0926 0.1043 2.35
2.65
-
A1
0.0040 0.0118 0.10
0.30
-
B
0.014
0.019
0.35
0.49
9
C
0.0091 0.0125 0.23
0.32
-
D
0.4961 0.5118 12.60
13.00
3
E
0.2914 0.2992 7.40
7.60
4
e
0.050 BSC
1.27 BSC
-
H
0.394
0.419 10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
20
20
7
α
0°
8°
0°
8°
-
Rev. 2 6/05
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31
FN6668.7
June 4, 2010