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ISL12022 Datasheet, PDF (5/28 Pages) Intersil Corporation – Real Time Clock with On Chip ±5ppm Temp Compensation
ISL12022
I2C Interface Specifications Test Conditions: VDD = +2.7 to +5.5V, TA = -40°C to +85°C, unless otherwise specified. (Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 9)
TYP
MAX
(Note 5) (Note 9) UNITS NOTES
tHD:STO
tDH
tR
tF
Cb
STOP Condition Hold Time
From SDA rising edge to
600
SCL falling edge. Both
crossing 70% of VDD.
Output Data Hold Time
From SCL falling edge
0
crossing 30% of VDD, until
SDA enters the 30% to 70%
of VDD window.
SDA and SCL Rise Time
From 30% to 70% of VDD. 20 + 0.1 x Cb
SDA and SCL Fall Time
From 70% to 30% of VDD. 20 + 0.1 x Cb
Capacitive loading of SDA or SCL Total on-chip and off-chip
10
ns
ns
300
ns
8
300
ns
8
400
pF
8
RPU
SDA and SCL Bus Pull-up Resistor Maximum is determined by
1
Off-chip
tR and tF.
For Cb = 400pF, max is about
2kΩ~2.5kΩ.
For Cb = 40pF, max is about
15kΩ~20kΩ
kΩ
8
NOTES:
2. Temperature Conversion is inactive below VBAT = 2.7V. Device operation is not guaranteed at VBAT<1.8V.
3. IRQ/FOUT inactive.
4. VDD > VBAT +VBATHYS
5. Specified at +25°C.
6. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
7. Limits should be considered typical and are not production tested.
8. These are I2C specific parameters and are not tested, however, they are used to set conditions for testing devices to validate
specification.
9. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
10. Specifications are typical and require using a recommended crystal (see “Application Section” on page 25).
11. Minimum VDD and/or VBAT of 1V to sustain the SRAM. The value is based on characterization and it is not tested.
5
FN6659.2
June 23, 2009