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ISL6264 Datasheet, PDF (3/24 Pages) Intersil Corporation – Two-Phase Core Controller for AMD Mobile Turion CPUs
ISL6264
Absolute Maximum Ratings
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 - +7V
Battery Voltage, VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +28V
Boot Voltage (BOOT) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +33V
Boot to Phase Voltage (BOOT-PHASE). . . . . . . . -0.3V to +7V(DC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +9V (<10ns)
Phase Voltage (PHASE) . . . . . . . . . -7V (<20ns Pulse Width, 10µJ)
UGATE Voltage (UGATE) . . . . . . . . . PHASE -0.3V (DC) to BOOT
PHASE-5V (<20ns Pulse Width, 10µJ) to BOOT
LGATE Voltage (LGATE) . . . . . . . . . . . . . . -0.3V (DC) to VDD+0.3V
-2.5V (<20ns Pulse Width, 5µJ) to VDD+0.3V
ALL Other Pins. . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to (VDD +0.3V)
Open Drain Outputs, PGOOD, VR_TT# . . . . . . . . . . . . . -0.3 - +7V
Thermal Information
Thermal Resistance (Typical, Notes 1, 2) θJA (°C/W) θJC (°C/W)
QFN Package. . . . . . . . . . . . . . . . . . . .
32
4
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
Recommended Operating Conditions
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+5V ±5%
Voltage, VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to 25V
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . .-10°C to +100°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .-10°C to +125°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to 150°C junction may trigger the shutdown of
the device even before 150°C, since this number is specified as typical.
NOTES:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications VDD = 5V, TA = -10°C to +100°C, Unless Otherwise Specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNITS
INPUT POWER SUPPLY
IVDD
+5V Supply Current
VR_ON = 3.3V
VR_ON = 0V
-
3.1 3.6 mA
-
-
1
µA
IVIN
Battery Supply Current at VIN pin
PORr POR (Power-On Reset) Threshold
PORf
SYSTEM AND REFERENCES
VR_ON = 0V, VIN = 25V,
VDD Rising
VDD Falling
-
-
1
µA
- 4.35 4.5
V
3.9 4.1
-
V
%Error System Accuracy
(VDD_core)
No load, closed loop, active mode, TA = +25°C to +100°C, -0.5
-
0.5
%
VID = 0.75-1.55V
VID = 0.425-0.75V
-2
-
+2
%
VID = 0.375-0.425V
-4
-
+4
%
RRBIAS
VDD_core
(max)
RBIAS Voltage
Maximum Output Voltage
RRBIAS = 147kΩ
VID = [000000]
1.5 1.52 1.54 V
- 1.55 -
V
VDD_core Minimum Output Voltage
(min)
VID = [111111]
- 0.375 -
V
CHANNEL FREQUENCY
fSW
Nominal Channel Frequency
Adjustment Range
RFSET = 6.81kΩ, 2 channel operation,
Vcomp = 2V
285 300 315 kHz
200
-
500 kHz
AMPLIFIERS
Droop Amplifier Offset
-0.3
0.3 mV
AV0
GBW
Error Amp DC Gain (Note 3)
Error Amp Gain-Bandwidth Product CL = 20pF
(Note 3)
-
90
-
dB
-
18
- MHz
SR
Error Amp Slew Rate (Note 3)
CL = 20pF
-
5.0
- V/µs
3
FN6359.1
October 16, 2006