80960JA Datasheet, PDF (36/77 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

80960JA/JF/JD/JT 3.3 V Microprocessor
Table 14.
132-Lead PQFP Package Thermal Characteristics
Parameter
θ_JC (Junction-to-Case)
θ_CA (Case-to-Ambient -No Heatsink)
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
0
50
100
200
400
(0)
(0.25) (0.50) (1.01) (2.03)
4.1
4.3
4.3
4.3
4.3
23
19
18
16
14
600
(3.04)
4.7
11
800
(4.06)
4.9
9
θ_JA
θ_CA
θ_JC
Table 15.
θ_JB
θ_JL
NOTES:
1. This table applies to a PQFP device soldered directly into board.
2. θ_JA = θ_JC + θ_CA
3. θ_JL = 13°C/W (approx.)
4. θ_JB = 13.5°C/W (approx.)
Maximum T_A at Various Airflows in °C (80960JT)
PQFP T_A without Heatsink
Package
T_A without Heatsink
PGA
Package
HT^AeawtisthinkO^{1mnidirectional}
TH_{AeawtisthinkU2}nidirectional
0
f_CLKIN (MHz) ₍₀₎
33
62
25
71
33
58
25
68
33
75
25
81
33
73
25
79
Airflow-ft/min (m/sec)
200 400 600 800
(1.01) (2.03) (3.04) (4.06)
73
76
81
85
79
82
86
88
68
76
80
81
75
82
84
86
85
90
92
93
88
92
94
95
86
90
92
93
90
92
94
95
1000
(5.07)
88
91
83
87
93
95
93
95
MPBGA T_A without Heatsink
Package
33
TBD TBD TBD TBD TBD TBD
25
TBD TBD TBD TBD TBD TBD
NOTES:
1. 0.248” high omnidirectional heatsink (AI alloy 6061, 41 mil fin width, 124 mil center-to-center fin spacing).
2. 0.250” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin spacing).
36
Advance Information Datasheet