80960JA Datasheet, PDF (35/77 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

80960JA/JF/JD/JT 3.3 V Microprocessor
Table 12.
132-Lead PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
θ_JC (Junction-to-Case)
θ_CA (Case-to-Ambient) (No Heatsink)
θ_CA (Case-to-Ambient) (Omnidirectional Heatsink)
θ_CA (Case-to-Ambient) (Unidirectional Heatsink)
Airflow — ft./min (m/sec)
0
200
400
600
800
(0)
(1.01) (2.03) (3.04) (4.06)
0.7
0.7
0.7
0.7
0.7
25
19
14
12
11
15
9
6
5
4
16
8
6
5
4
θ_J-PIN
θ_JA
θ_CA
θ_JC
θ_J-CAP
1000
(5.08)
0.7
10
4
4
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2. θ_JA = θ_JC + θ_CA
3. θ_J-CAP = 5.6°C/W (approximate) (no heatsink)
4. θ_J-PIN = 6.4°C/W (inner pins) (approximate) (no heatsink)
5. θ_J-PIN = 6.2°C/W (outer pins) (approximate) (no heatsink)
6. θ_J-CAP = 3°C/W (approximate) (with heatsink)
7. θ_J-PIN = 3.3°C/W (inner pins) (approximate) (with heatsink)
8. θ_J-PIN = 3.3°C/W (outer pins) (approximate) (with heatsink)
Table 13.
196-Ball MPBGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
θ_JC (Junction-to-Case)
θ_CA (Case-to-Ambient) (No Heatsink)
θ_CA (Case-to-Ambient) (Omnidirectional Heatsink)
θ_CA (Case-to-Ambient) (Unidirectional Heatsink)
0
(0)
TBD
TBD
TBD
TBD
Airflow — ft./min (m/sec)
200
(1.01)
TBD
TBD
TBD
TBD
400
(2.03)
TBD
TBD
TBD
TBD
600
(3.04)
TBD
TBD
TBD
TBD
800
(4.06)
TBD
TBD
TBD
TBD
1000
(5.08)
TBD
TBD
TBD
TBD
TBD
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