80960MC Datasheet, PDF (32/39 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT AND MEMORY MANAGEMENT UNIT

80960MC
3.3 Package Thermal Specification
The 80960MC is specified for operation when case
temperature is within the range 0°C to 85°C (PGA).
Measure case temperature at the top center of the
package. Ambient temperature can be calculated
from:
• T_J = T_C + P*θ_jc
• T_A = T_J + P*θ_ja
• T_C = T_A + P*[θ_ja−θ_jc]
Values for θ_ja and θ_jc for various airflows are given in
Table 10 for the PGA package. The PGA’s θ_ja can
be reduced by adding a heatsink.
Maximum allowable ambient temperature (T_A)
permitted without exceeding T_C is shown by the
graphs in Figure 23, Figure 24 and Figure 25. The
curves assume the maximum permitted supply
current (I_CC) at each speed, V_CC of +5.0 V and a
T_CASE of +85° C (PGA).
Table 10. 80960MC PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
Parameter
0
50 100 200 400 600 800
(0) (0.25) (0.50) (1.01) (2.03) (3.04) (4.06)
θ Junction-to-Case 2
2
2
2
2
2
2
θ Case-to-Ambient 19
18
17
15
12
10
9
(No Heatsink)
θ Case-to-Ambient 16
15
14
12
9
7
6
(Omnidirectional
Heatsink)
θ Case-to-Ambient 15
14
13
11
8
6
5
(Unidirectional
Heatsink)
NOTES:
1. This table applies to 80960MC PGA plugged into socket or soldered directly to board.
2. θ_JA = θ_JC + θ_CA
3. θ_J-CAP = 4°C/W (approx.)
θ_J-PIN = 4°C/W (inner pins) (approx.)
θ_J-PIN = 8°C/W (outer pins) (approx.)
θ_JA
θ_J-PIN
θ_JC
θ_J-CAP
28
PRELIMINARY