80960CF-40 Datasheet, PDF (27/77 Pages) Intel Corporation – 80960CF-40, -33, -25, -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR EMBEDDED MICROPROCESSOR

A
80960CF-40, -33, -25, -16
Table 10. 80960CF PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
Parameter
0
200 400 600
800
(0) (1.01) (2.03) (3.07) (4.06)
θ Junction-to-Case
1.5 1.5 1.5
1.5
1.5
(Case measured as
shown in Figure 5)
θ Case-to-Ambient
17 14
11
9
7.1
(No Heatsink)
θ Case-to-Ambient
13
9
5.5
5
3.9
(With Heatsink)*
1000
(5.07)
1.5
6.6
3.4
θ_JA
θ_JC
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NOTES:
1. This table applies to 80960CF PGA plugged into socket or soldered directly to board.
2. θ_JA = θ_JC + θ_CA
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 11. 80960CF PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
Parameter
0
50
100
200
400
(0) (0.25) (0.50) (1.01) (2.03)
θ Junction-to-Case (Case Measured
5
5
5
5
5
as shown in Figure 5)
θ Case-to-Ambient (No Heatsink)
19
18
17
15
12
NOTES:
1. This table applies to 80960CF PQFP soldered directly to board.
2. θ_JA = θ_JC + θ_CA
600
(3.04)
5
10
800
(4.06)
5
9
θ_JC
PRELIMINARY
21