HYS72D32500GR Datasheet, PDF (7/39 Pages) Infineon Technologies AG – Registered DDR SDRAM-Modules

HYS72D[128/64/32]5[00/20/21]GR–[7F/7/8]-B
Registered DDR SDRAM-Modules
Overview
Table 2 Ordering Information
Product Type
Compliance Code
PC2100 (CL = 2):
HYS72D32500GR-7F-B
HYS72D32500GR-7-B
HYS72D64500GR-7F-B
HYS72D64500GR-7-B
HYS72D128520GR-7F-B
PC2100R-20220-L
PC2100R-20330-L
PC2100R-20220-M
PC2100R-20330-M
PC2100R-20220-N
HYS72D128520GR-7-B PC2100R-20330-N
HYS72D128521GR-7F-B PC2100R-20220-N
HYS72D128521GR-7-B PC2100R-20330-N
PC1600 (CL = 2):
HYS72D32500GR-8-B
HYS72D64500GR-8-B
HYS72D128521GR-8-B
PC1600R-20220-L
PC1600R-20220-M
PC1600R-20220-M
Description
SDRAM
Technology
one rank 256 MB Registered DIMM
one rank 256 MB Registered DIMM
one rank 512 MB Registered DIMM
one rank 512 MB Registered DIMM
two ranks 1 GByte Registered DIMM
two ranks 1 GByte Registered DIMM
two ranks 1 GByte Registered DIMM
two ranks 1 GByte Registered DIMM
256 Mbit (x8)
256 Mbit (x8)
256 Mbit (x4)
256 Mbit (x4)
256 MBit (x4)
(stacked with
soldering process)
256 MBit (x4)
(stacked with
soldering process)
256 MBit (x4)
(stacked with laser
welding process)
256 MBit (x4)
(stacked with laser
welding process)
one rank 256 MB Registered DIMM
one rank 512 MB Registered DIMM
two ranks 1GByte Registered DIMM
256 Mbit (x8)
256 Mbit (x4)
256Mbit (x4)
(stacked with laser
welding process)
Note: All “product type” end with a place code designating the silicon-die revision. Reference information available
on request. Example: HYS72D32500GR-7-B, indicating rev. C dies are used for SDRAM components. The
“compliance code” is printed on the module labels describing the speed sort (for example “PC2100”), the
latencies and SPD code definition (for example “20330” means CAS latency of 2.0 clocks, RCD¹⁾ latency of
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
1) RCD: Row-Column-Delay
Data Sheet
7
Rev. 1.03 2004-01