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HYB39S256400D Datasheet, PDF (20/28 Pages) Infineon Technologies AG – 256-MBit Synchronous DRAM
HYB39S256[40/80/16]0D[C/T](L)
256-MBit Synchronous DRAM
Electrical Characteristics
4
Electrical Characteristics
4.1
Operating Conditions
Table 10 Absolute Maximum Ratings
Parameter
Symbol
Input / Output voltage relative to VSS
Voltage on VDD supply relative to VSS
Voltage on VDDQ supply relative to VSS
Operating Temperature
Storage temperature range
Power dissipation per SDRAM component
Data out current (short circuit)
VIN, VOUT
VDD
VDDQ
TA
TSTG
PD
IOUT
Limit Values
min.
max.
– 1.0
+4.6
– 1.0
+4.6
– 1.0
+4.6
0
+70
-55
+150
–
1
–
50
Unit Note/
Test Condition
V
–
V
–
V
–
οC
–
oC
–
W
–
mA –
Attention: Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded.Functional
operation should be restricted to recommended operation conditions. Exposure to higher than
recommended voltage for extended periods of time affect device reliability
Table 11 DC Characteristics1)
Parameter
Symbol
Values
min.
max.
Unit Note/
Test Condition
Supply Voltage
I/O Supply Voltage
Input high voltage
Input low voltage
Output high voltage (IOUT = – 4.0 mA)
Output low voltage (IOUT = 4.0 mA)
VDD
VDDQ
VIH
VIL
VOH
VOL
3.0
3.6
V
2)
3.0
3.6
V
2)
2.0
VDDQ+0.3 V
2)3)
– 0.3
+0.8
V
2)3)
2.4
–
V
2)
–
0.4
V
2)
Input leakage current, any input
IIL
(0 V < VIN < VDD, all other inputs = 0 V)
Output leakage current
IOL
(DQs are disabled, 0 V < VOUT < VDDQ)
–5
+5
–5
+5
mA –
mA –
1) TA = 0 to 70 οC
2) All voltages are referenced to VSS
3) VIH may overshoot to VDDQ + 2.0 V for pulse width of < 4ns with 3.3V. VIL may undershoot to -2.0 V for pulse width < 4.0 ns
with 3.3V. Pulse width measured at 50% points with amplitude measured peak to DC reference.
Data Sheet
20
Rev. 1.02, 2004-02
10072003-13LE-FGQQ