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HYB39S256400DT Datasheet, PDF (16/22 Pages) Infineon Technologies AG – 256 MBit Synchronous DRAM
HYB39S256400/800/160DT(L)/DC(L)
256MBit Synchronous DRAM
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min.
max.
Input / Output voltage relative to VSS
VIN, VOUT
– 1.0
4.6 V
Power supply voltage
Operating Temperature
Storage temperature range
VDD,VDDQ
TA
TSTG
– 1.0
0
-55
4.6 V
+70 oC
+150 oC
Power dissipation per SDRAM component
PD
–
1
W
Data out current (short circuit)
IOS
–
50 mA
Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded.
Functional operation should be restricted to recommended operation conditions.
Exposure to higher than recommended voltage for extended periods of time affect device reliability
Recommended Operation Conditions and DC Eletrical Characteristics
TA = 0 to 70 oC;
Parameter
Symbol
Limit Values
Unit Notes
min.
typ.
max.
Supply Voltage
VDD,VDDQ 3.0
3.3
3.6
V1
Input high voltage
VIH
2.0
3.0 VDDQ+0.3 V 1, 2
Input low voltage
VIL
– 0.3
0
0.8
V 1, 2
Output high voltage (IOUT = – 4.0 mA) VOH
2.4
–
–
V1
Output low voltage (IOUT = 4.0 mA) VOL
–
–
0.4
V1
Input leakage current, any input IIL
(0 V < VIN < VDD, all other inputs = 0 V)
–5
–
5
mA
Output leakage current
IOL
(DQs are disabled, 0 V < VOUT < VDDQ)
–5
–
5
mA
Notes:
1. All voltages are referenced to VSS.
2. Vih may overshoot to VDDQ + 2.0 V for pulse width of < 4ns with 3.3V. Vil may undershoot to -2.0 V for pulse
width < 4.0 ns with 3.3V. Pulse width measured at 50% points with amplitude measured peak to DC
reference.
INFINEON Technologies
16
2002-04-23