TC1791 Datasheet, PDF (146/153 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller

TC1791
Electrical ParametersPackage and Reliability
5.5
Package and Reliability
5.5.1 Package Parameters
Table 44 Thermal Characteristics of the Package
Device
TC1791
Package
PG-LFBGA- 292-6
R_ΘJCT1)
3,73
R_ΘJCB1) R_ΘJA
4,98 15,0
Unit
K/W
Note
1) The top and bottom thermal resistances between the case and the ambient (R_TCAT, R_TCAB) are to be combined
with the thermal resistances between the junction and the case given above (R_TJCT, R_TJCB), in order to calculate
the total thermal resistance between the junction and the ambient (R_TJA). The thermal resistances between
the case and the ambient (R_TCAT, R_TCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: T_J = T_A + R_TJA × P_D, where the R_TJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R_TJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ’cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
139
V 1.1, 2014-05