XC2361A Datasheet, PDF (120/123 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

XC2361A, XC2363A, XC2364A, XC2365A
XC2000 Family Derivatives / Base Line
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following specifications ensure proper
integration of the XC236xA into the target system.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 39 Package Parameters (PG-LQFP-100-8)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
6.2 × 6.2 mm –
Power Dissipation
Thermal resistance
Junction-Ambient
P_DISS
–
R_ΘJA
–
1.0
W–
47
K/W No thermal via¹⁾
29
K/W 4-layer, no pad²⁾
23
K/W 4-layer, pad³⁾
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC236xA is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar series and subfamilies.
Each package is optimized for the chip it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
120
V2.0, 2009-03