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ICS9P935 Datasheet, PDF (8/13 Pages) Integrated Device Technology – DDR I/DDR II Phase Lock Loop Zero Delay Buffer
ICS9P935
DDR I/DDR II Phase Lock Loop Zero Delay Buffer
Timing Requirements
TA = 0 - =70°C; Supply Voltage AVDD, VDD = 2.5 V +/- 0.2V (unless otherwise stated)
PARAMETER
SYMBOL
CONDITIONS
MIN MAX
Max clock frequency
freqop
2.5V+0.2V @ 25oC
45
600
Application Frequency
Range
freqApp
2.5V+0.2V @ 25oC
95
233
Input clock duty cycle
dtin
40
60
UNITS
MHz
MHz
%
CLK stabilization
TSTAB
15
µs
Switching Characteristics3
PARAMETER
SYMBOL
CONDITION
Low-to high level
propagation delay time
High-to low level propagation
delay time
tPLH1
tPLL1
BUF_IN to any output
BUF_IN to any output
Period jitter
Half-period jitter
Tjit (per)
t(jit_hper)
100MHz to 200MHz
100MHz to 200MHz
Input clock slew rate
Output clock slew rate
Cycle to Cycle Jitter1
Static Phase Offset
Output to Output Skew
tsl(i)
tsl(o)
Tcyc-Tcyc 100MHz to 200MHz
t(static
phase
4
offset)
Tskew
MIN
-30
-100
1
1
-50
-50
Notes:
1. Refers to transition on noninverting output in PLL bypass mode.
2. While the pulse skew is almost constant over frequency, the duty cycle error increases at
higher frequencies. This is due to the formula: duty cycle=twH/tc, were the cycle (tc)
decreases as the frequency goes up.
3. Switching characteristics guaranteed for application frequency range.
4. Static phase offset shifted by design.
TYP
3.5
3.5
0
MAX UNITS
ns
ns
30
ps
100 ps
4 V/ns
2 V/ns
50
ps
50
ps
40
ps
IDTTM/ICSTM DDR I/DDR II Phase Lock Loop Zero Delay Buffer
8
ICS9P935 REV H 12/1/08