IC-MB4_15 Datasheet, PDF (7/40 Pages) IC-Haus GmbH – BiSS INTERFACE MASTER

iC-MB4
BiSS INTERFACE MASTER
preliminary
Rev B2, Page 7/40
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item Symbol Parameter
No.
Conditions
G001 VDD
Voltage at VDD
G002 I(VDD) Current in VDD
G003 V()
Voltage at all pins, excluding VDD and V() VDD + 0.3 V
GND
G004 I()
Current in all pins excluding VDD and
GND
G005 V_esd()
ESD Susceptibility at all pins
HBM, 100 pF discharged through
1.5 Ω
G006 Tj
Operating Junction Temperature
VDD = 3.0 V ... 4.5 V
VDD = 4.5 V ... 5.5 V
G007 Ts
Storage Temperature Range
Min.
-0.3
-20
-0.3
-10
-40
-40
-40
Unit
Max.
6
V
30
mA
6
V
10
mA
2
kV
125
°C
140
°C
150
°C
THERMAL DATA
Operating Conditions: VDD = 3.0 V. . . 5.5 V
Item Symbol Parameter
No.
T01 Ta
Standard Operating Ambient
Temperature Range
T02 Ta_ET
Extended Operating Ambient
Temperature Range
T03 R_thjaTSSOP Thermal Resistance Chip to Ambient
T04 R_thjaQFN Thermal Resistance Chip to Ambient
Conditions
VDD = 4.5 V ... 5.5 V
available on request
TSSOP24 surface mounted,
no special heat sink
QFN28 package mounted on PCB,
thermal pad at approx. 2 cm² cooling area
Unit
Min. Typ. Max.
-40
85 °C
-40
125 °C
80
K/W
40
K/W
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.