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GS832418B Datasheet, PDF (45/46 Pages) GSI Technology – 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
512K x 72
GS832472C-225I
SCD/DCD Pipeline/Flow Through
209 BGA
225/6.5
I
512K x 72
GS832472C-200I
SCD/DCD Pipeline/Flow Through
209 BGA
200/7.5
I
512K x 72
GS832472C-166I
SCD/DCD Pipeline/Flow Through
209 BGA
166/8.5
I
512K x 72
GS832472C-150I
SCD/DCD Pipeline/Flow Through
209 BGA
150/10
I
512K x 72
GS832472C-133I
SCD/DCD Pipeline/Flow Through
209 BGA
133/11
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832418B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00 10/2001
45/46
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.