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GS832418B Datasheet, PDF (4/46 Pages) GSI Technology – 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs
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Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418C Pad Out
209-Bump BGA—Top View
1
2
3
4
5
6
7
8
9
10
11
A
NC
NC
A15
MCH ADSP ADSC ADV
MCL
A17
NC
NC
A
B
NC
NC
BB
NC
A19
BW
A16
NC
NC
NC
NC
B
C
NC
NC
NC
NC
NC
E1
A20
NC
BA
NC
NC
C
D
NC
NC
VSS
NC
NC
G
GW
NC
VSS
NC
NC
D
E
NC
DQPB9
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
NC
NC
E
F
DQB4
DQB8
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
NC
NC
F
G
DQB3
DQB7
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
NC
NC
G
H
DQB2
DQB6
VSS
VSS
VSS
MCL
VSS
VSS
VSS
NC
NC
H
J
DQB1
DQB5
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
NC
NC
J
K
NC
NC
CK
NC
VSS
MCL
VSS
NC
NC
NC
NC
K
L
NC
NC
VDDQ
VDDQ
VDD
FT
VDD
VDDQ
VDDQ
DQA5
DQA1
L
M
NC
NC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQA6
DQA2
M
N
NC
NC
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
DQA7
DQA3
N
P
NC
NC
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQA8
DQA4
P
R
NC
NC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPA9
NC
R
T
NC
NC
VSS
NC
NC
LBO
NC
NC
VSS
NC
NC
T
U
NC
NC
NC
A14
A13
A12
A11
A10
A18
NC
NC
U
V
NC
NC
A9
A8
A7
A1
A6
A5
A4
NC
NC
V
W
NC
NC
TMS
TDI
A3
A0
A2
TDO
TCK
NC
NC
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Rev: 1.00 10/2001
4/46
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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