GS8324Z18B Datasheet, PDF (42/46 Pages) GSI Technology – 2M x 18, 1M x 36, 512K x 72 36Mb Sync NBT SRAMs

Package Dimensions—119-Pin PBGA
119-Bump BGA Package
Pin 1
A
Corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
Top View
Side View
Preliminary
GS8324Z18(B/C)/GS8324Z36(B/C)/GS8324Z72(C)
7654321
A
B
G
C
D
E
F
G
B
S^D
H
J
K
L
M
N
P
R
T
U
R
Bottom View
Package Dimensions—119-Pin PBGA
Symbol
Description
Min. Nom. Max
A
Width
13.9 14.0 14.1
B
Length
21.9 22.0 22.1
C
Package Height (including ball) 1.73 1.86 1.99
D
Ball Size
0.60 0.75 0.90
E
Ball Height
0.50 0.60 0.70
F Package Height (excluding balls) 1.16 1.26 1.36
G
Width between Balls
1.27
K
Package Height above board 0.65 0.70 0.75
R Width of package between balls
7.62
S Length of package between balls
20.32
T
Variance of Ball Height
0.15
Unit: mm
Rev: 1.00 10/2001
42/46
© 2001, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.