GS4576C09 Datasheet, PDF (38/62 Pages) GSI Technology – 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM (LLDRAM II)

GS4576C09/18/36L
Recommended Operating Temperature and Thermal Impedance
Like any other semiconcuctor device, the LLDRAM II must be operated within the temperature specifications shown in the
Temperature Limits table for the device to meet datasheet specifications. The thermal impedance characteristics of the device are
are listed below. In applications where the ambient temperature or PCB temperature are too high, use of forced air and/or heat
sinks may be required in order to satisfy the case temperature specifications.
Temperature Limits
Parameter
Temperature
Range
Symbol
Min.
Max.
Operating junction temperature
Commercial
0
+100
Industrial
T_J
–40
+100
Operating case temperature
Commercial
0
+95
Industrial
T_C
–40
+95
Notes:
1. Junction temperature depends upon package type, cycle time, loading, ambient temperature, and airflow.
2. Maximum operating case temperature, T_C, is measured in the center of the package.
3. Device functionality is not guaranteed if the device exceeds maximum T_C during operation.
4. Junction and case temperature specifications must be satisfied.
Unit Notes
C°
1
C°
1
C°
2, 3
C°
2, 3, 4
Thermal Impedance
Package
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
 JA (C°/W)
Airflow = 1 m/s
 JA (C°/W)
Airflow = 2 m/s
JB (C°/W)  JC (C°/W)
BGA
2-layer
TBD
TBD
4-layer
22.4
19.0
TBD
TBD
TBD
16.2
5.3
1.7
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. The minimal metalization of a 2-layer
board tends to minimize the utility of the junction-to-board heat path. The 4-layer test fixture PCB is intended to highlight the effect of
connection to power planes typically found in the PCBs used in most applications. Be advised that a good thermal path to the PCB can
result in cooling or heating of the RAM depending on PCB temperature.
Rev: 1.04 11/2013
38/62
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology