GS8170LW36 Datasheet, PDF (25/27 Pages) GSI Technology – 18Mb sigma 1x1Lp CMOS I/O Late Write SigmaRAM

A
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GS8170LW36/72C-333/300/250/200
209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
Side View
D
D1
e
Bottom View
∅b
e
Symbol
Min
Typ
Max Units Symbol
Min
Typ
Max
Units
A
—
—
1.70
mm
D1
—
18.0 (BSC)
—
mm
A1
0.40
0.50
0.60
mm
E
13.9
14.0
14.1
mm
∅b
0.50
0.60
0.70
mm
E1
—
10.0 (BSC)
—
mm
c
0.31
0.36
0.38
mm
e
—
1.00 (BSC)
—
mm
D
21.9
22.0
22.1
mm
aaa
—
0.15
—
mm
Rev 1.0
Rev: 2.03 1/2005
25/27
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology, Inc.