GS8170LW36 Datasheet, PDF (22/27 Pages) GSI Technology – 18Mb sigma 1x1Lp CMOS I/O Late Write SigmaRAM

GS8170LW36/72C-333/300/250/200
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
V_DD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
V_DDQ/2
Output reference level
V_DDQ/2
Notes:
1. Include scope and jig capacitance.
2. Test conditions as as shown unless otherwise noted.
JTAG Port AC Test Load
DQ
50Ω
30pF^*
V_DDQ/2
* Distributed Test Jig Capacitance
JTAG TAP Instruction Set Summary
Instruction Code
Description
EXTEST
000 Places the Boundary Scan Register between TDI and TDO.
IDCODE
001 Preloads ID Register and places it between TDI and TDO.
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
Forces all RAM output drivers to High-Z.
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
GSI
101 GSI private instruction.
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
BYPASS
111 Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Notes
1
1, 2
1
1
1
1
1
1
Rev: 2.03 1/2005
22/27
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2002, GSI Technology, Inc.