MB82DBS08164C-70L Datasheet, PDF (57/58 Pages) Fujitsu Component Limited. – 128 M Bit (8 M word×16 bit) Mobile Phone Application Specific Memory

MB82DBS08164C-70L
• Package Dimension
115-ball plastic FBGA
(BGA-115P-M03)
12.00±0.10(.472±.004)
INDEX-MARK AREA
0.08(.003) S
0.20(.008) S B
1.25±0.10 _{(Seated height)}
(.049±.004)
B
0.40(.016)
REF
0.80(.031)
REF
0.80(.031)
10
REF
9
8
A
7
9.00±0.10
6
(.354±.004)
0.40(.016)
5
REF
4
3
0.08(.003) S
2
1
0.10±0.05
(.004±.002)
(Stand
off)
S
0.20(.008) S A
PNML K J HGF EDCBA
115-ø0.40
+.010
–0.05
115-ø.016
+.004
–.002
ø0.08(.003) M S A B
C _{2003 FUJITSU LIMITED B115003S-c-1-1}
■ ORDERING INFORMATION
Part Number
MB82DBS08164C-70LWT
Dimensions in mm (inches)
Note : The values in parentheses are reference values.
Shipping Form
wafer
Remarks
57