MB82DBS08164C-70L Datasheet, PDF (2/58 Pages) Fujitsu Component Limited. – 128 M Bit (8 M word×16 bit) Mobile Phone Application Specific Memory

MB82DBS08164C-70L
■ PRODUCT LINEUP
Parameter
Access Time (Max) (tCE, tAA)
CLK Access Time (Max) (tAC)
RL = 6, 7
Active Current (Max) (IDDA1)
Standby Current (Max) (IDDS1)
Power Down Current (Max) (IDDPS)
MB82DBS08164C-70L
70 ns
6 ns
40 mA
300 µA
10 µA
■ PIN DESCRIPTION
Pin Name
Description
A22 to A0
Address Input
CE1
Chip Enable 1 (Low Active)
CE2
Chip Enable 2(High Active)
WE
Write Enable (Low Active)
OE
Output Enable (Low Active)
LB
Lower Byte Control (Low Active)
UB
Upper Byte Control (Low Active)
CLK
Clock Input
ADV
Address Valid Input (Low Active)
WAIT
Wait Output
DQ7 to DQ0
Lower Byte Data Input/Output
DQ15 to DQ8
Upper Byte Data Input/Output
VDD
Power Supply Voltage
VSS
Ground
Note : Refer to "■PACKAGE FOR ENGINEERING SAMPLES" for additional pin descriptions of FBGA package
supply.
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