MC68HC05C9E Datasheet, PDF (95/106 Pages) Freescale Semiconductor, Inc – Microcontrollers

Chapter 13
Mechanical Specifications
13.1 Introduction
This section describes the dimensions of the plastic dual in-line package (DIP), and quad flat pack (QFP)
MCU packages.
Package dimensions available at the time of this publication are provided in this section.
To make sure that you have the latest case outline specifications, contact one of the following:
• Local Freescale Sales Office
• World Wide Web at http://www.freescale.com
Follow World Wide Web on-line instructions to retrieve the current mechanical specifications.
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
40
1
H
A
G
F
21
B
20
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 51.69 52.45
B 13.72 14.22
C 3.94 5.08
D 0.36 0.56
F 1.02 1.52
G
2.54 BSC
H 1.65 2.16
J 0.20 0.38
K 2.92 3.43
L
15.24 BSC
M
0°
1°
N 0.51 1.02
INCHES
MIN MAX
2.035 2.065
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0°
1°
0.020 0.040
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
MC68HC05C9E Advance Information Data Sheet, Rev. 0.1
Freescale Semiconductor
95