MC9328MXL_06 Datasheet, PDF (87/90 Pages) Freescale Semiconductor, Inc – MX Family of applications processors

5.2 MAPBGA 225 Package Dimensions
Figure 68 illustrates the 225 MAPBGA 13 mm × 13 mm package.
Case Outline 1304B
Pin-Out and Package Information
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2.DIMENSIONS AND TOLERANCES PER ASME Y14 5M-1994.
3.MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE IS DEFINED BY SPHERICAL CROWNS OF THE SOLDER
BALLS.
5.PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE
OF PACKAGE
Figure 68. i.MXL 225 MAPBGA Mechanical Drawing
MC9328MXL Technical Data, Rev. 8
Freescale Semiconductor
87