MC9S08DN60 Datasheet, PDF (343/354 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix C
Ordering Information and Mechanical Drawings
C.1 Ordering Information
This section contains ordering information for MC9S08DN60 Series devices.
Example of the device numbering system:
MC 9 S08 DN 32 M XX
Status
(MC = Fully Qualified)
(S = Auto Qualified)
Memory
(9 = Flash-based)
Core
Family
Package designator (see Table C-2)
Temperature range
(C = –40°C to 85°C)
(V = –40°C to 105°C)
(M = –40°C to 125°C)
Approximate Flash size in KB
C.1.1 MC9S08DN60 Series Devices
Table C-1. Devices in the MC9S08DN60 Series
Device Number
FLASH
Memory
RAM
MC9S08DN60
62,080
MC9S08DN48
49,152
MC9S08DN32
33,792
MC9S08DN16
16,896
1 _{See Table C-2 for package information.}
2048
2048
1536
1024
EEPROM
2048
1536
1024
512
Available Packages¹
64-LQFP,
48-LQFP, 32-LQFP
48-LQFP, 32-LQFP
C.2 Mechanical Drawings
The following pages are mechanical drawings for the packages described in the following table:
Table C-2. Package Descriptions
Pin Count
64
48
32
Type
Low Quad Flat Package
Low Quad Flat Package
Low Quad Flat Package
Abbreviation
LQFP
LQFP
LQFP
Designator
LH
LF
LC
Document No.
98ASS23234W
98ASH00962A
98ASH70029A
MC9S08DN60 Series Data Sheet, Rev 2
Freescale Semiconductor
343