33874 Datasheet, PDF (34/37 Pages) Freescale Semiconductor, Inc – Quad High-Side Switch (Quad 35 mΩ)

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Transparent Top View
13 12 11 10 9 8 7 6 5 4 3 2 1
SO 16
GND 17
HS3 18
14
GND
24 FSI
23 GND
22 HS2
15
VPWR
76.2 mm
A=
300sqmm
A=
300sqmm
19
20
21
HS1
NC
HS0
MC33874 Pin Connections
24-Pin PQFN (12 x 12)
0.9 mm Pitch
12.0 mm x 12.0 mm Body
Figure 11. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 19. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm²)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
0
53
38
61
R_θJAmn
300
44
32
56
600
42
30
55
R_θJA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
33874
34
Analog Integrated Circuit Device Data
Freescale Semiconductor