33874 Datasheet, PDF (27/37 Pages) Freescale Semiconductor, Inc – Quad High-Side Switch (Quad 35 mΩ)

PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 33874 is packaged in a surface mount power package
intended to be soldered directly on the printed circuit board.
The 33874 was qualified in accordance with JEDEC
standards JESD22-A113-B and J-STD-020A. The
recommended reflow conditions are as follows:
• Convection: 235°C +5.0/-0°C
• Vapor Phase Reflow (VPR): 235°C +5.0/-0°C
• Infrared (IR)/Convection: 235°C +5.0/-0°C
The maximum peak temperature during the soldering
process should not exceed 240°C. The time at maximum
temperature should range from 10 s to 40 s maximum.
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10596D listed below.
PNA SUFFIX (PB-FREE)
24-PIN PQFN
NONLEADED PACKAGE
98ARL10596D
ISSUE C
Analog Integrated Circuit Device Data
Freescale Semiconductor
33874
27