33874 Datasheet, PDF (33/37 Pages) Freescale Semiconductor, Inc – Quad High-Side Switch (Quad 35 mΩ)

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
33874
Introduction
This thermal addendum is provided as a supplement to the 33874 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
HIGH-SIDE SWITCH
Packaging and Thermal Considerations
This package is a dual die package. There are two heat sources in the package
independently heating with P₁ and P₂. This results in two junction temperatures,
T_J1 and T_J2, and a thermal resistance matrix with R_θJAmn.
For m, n = 1, R_θJA11 is the thermal resistance from Junction 1 to the reference
temperature while only heat source 1 is heating with P₁.
For m = 1, n = 2, R_θJA12 is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P₂. This applies to R_θJ21
and R_θJ22, respectively.
PNA SUFFIX
98ARL10596D
24-PIN PQFN (12 x 12)
T_J1
T_J2
=
R_θJA11
R_θJA21
R_θJA12
R_θJA22
.
P₁
P₂
Note For package dimensions, refer to
the 33874 data sheet.
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-specific environment. Stated values were obtained
by measurement and simulation according to the standards listed below.
Table 18. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip [°C/W]
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
R_θJAmn ^{(1), (2)}
20
16
39
R_θJBmn ^{(2), (3)}
6
2.0
26
R_θJAmn ^{(1), (4)}
53
40
73
R_θJCmn ⁽⁵⁾
<0.5
0.0
1.0
Notes:
1. Per JEDEC JESD51-2 at natural convection, still air
condition.
2. 2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3. Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
4. Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5. Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
1.0
0.2
1.0
0.2
Figure 10. Testboard According to JEDEC
Analog Integrated Circuit Device Data
Freescale Semiconductor
33874
33