S9S08SG8E2MTJ Datasheet, PDF (317/320 Pages) Freescale Semiconductor, Inc – MC9S08SG8 MC9S08SG4 Data Sheet Addendum

Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08SG8 and MC9S08SG4 devices.
Table B-1. Device Numbering System
Device
Number¹
Memory
FLASH
RAM
Temp Rated²
Standard AEC Grade 0
Available Packages³
20-Pin
16-Pin
8-Pin
S9S08SG8
8K
512
x
S9S08SG4
4K
256
x
20 TSSOP
S9S08SG8
8K
512
S9S08SG4
4K
256
x
—
x
1 _{See Table 1-1 for a complete description of modules included on each device.}
2 _{Apply to the temperature rated devices marked with x only.}
3 _{See Table B-2 for package information.}
16 TSSOP
16 TSSOP
8 NB SOIC
—
B.1.1 Device Numbering Scheme
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
Core
SG Family
S 9 S08 SG 8 E2 C TJ R
Memory Size
- 8 Kbytes
- 4 Kbytes
Tape and Reel Suffix (optional)
Package Designator
Two letter descriptor
(refer to Table B-2).
Temperature Option
- C = -40 to 85 C
- V = -40 to 105 C
- M = -40 to 125 C
- W = -40 to 150 C
Mask Set Identifier
- Alpha character references 
wafer fab.
- Numeric character identifies 
mask.
MC9S08SG8 MCU Series Data Sheet, Rev. 7
Freescale Semiconductor
313