S9S08SG8E2MTJ Datasheet, PDF (289/320 Pages) Freescale Semiconductor, Inc – MC9S08SG8 MC9S08SG4 Data Sheet Addendum

Appendix A Electrical Characteristics
A.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P_I/O into account in power calculations, determine the difference between actual pin
voltage and V_SS or V_DD and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and V_SS or V_DD will be very small.
Table A-3. Thermal Characteristics
Num
C
Rating
Symbol
Value
Temp Rated¹
Unit _Standar
AEC
d
Grade 0
1
— Operating temperature range
(packaged)
T_L to T_H
C
V
M
T_A
–40 to 85
–40 to 105
–40 to 125
x
C
x
x
W
–40 to 150
x
2
D Maximum junction temperature
C
C
T_J
95
x
V
115
x
M
135
x
W
D
Thermal resistance ^2,3
Single-layer board
3
8-pin NB SOIC
_JA
155
Airflow at
200 ft/min
Natural
Convection
131
153
x
x
16-pin TSSOP
115
135
C/W
x
x
20-pin TSSOP
95
115
x
4
D
Thermal resistance^2,3
Airflow at
Natural
Four-layer board
200 ft/min
Convection
8-pin NB SOIC
_JA
95
102
x
16-pin TSSOP
86
94
C/W
x
x
20-pin TSSOP
69
76
x
1 _{Electrical characteristics only apply to the temperature rated devices marked with x.}
2 _{Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,}
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
3 _{Junction to Ambient Natural Convection}
MC9S08SG8 MCU Series Data Sheet, Rev. 7
Freescale Semiconductor
285