S9S08SG8E2MTJ Datasheet, PDF (316/320 Pages) Freescale Semiconductor, Inc – MC9S08SG8 MC9S08SG4 Data Sheet Addendum

Appendix A Electrical Characteristics
A.14 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.14.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East).
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
Table A-17. Radiated Emissions, Electric Field
Parameter Symbol Conditions
Frequency
f_OSC/f_BUS
Level
(Max)
Temp Rated¹
Unit _{Standa AEC}
rd Grade 0
0.15 – 50 MHz
0
x
x
50 – 150 MHz
0
x
x
Radiated
emissions,
electric field
V_{RE_TEM}
V_DD = 5 V
T_A = +25^oC
package type
16-TSSOP
150 – 500 MHz
500 – 1000 MHz
4 MHz
crystal
16 MHzbus
–6
–9
dBV
x
x
x
x
IEC Level
N
—
x
x
SAE Level
1
1 _{Electrical characteristics only apply to the temperature rated devices marked with x.}
—
x
x
MC9S08SG8 MCU Series Data Sheet, Rev. 7
312
Freescale Semiconductor